By Duixian Liu; et al
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Extra resources for Advanced millimeter-wave technologies : antennas, packaging and circuits
3] D. Riley, ‘GPhone prototype debuts at mobile world congress’, Tech Crunch, February 11, 2008.  A. ’, Google Blog, November 11, 2007. html [December 29, 2008].  B Gaucher, B. Floyd, S. Reynolds, U. Pfeiffer, J. Grzyb, A. Joseph, E. Mina, B. Orner, H. Ding, R. Wachnik, and K. Walter, ‘Silicon germanium based millimetre-wave ICs for Gbps wireless communications and radar systems’, Semiconductor Science and Technology 22(1) (2007), S236– S243.  S. Reynolds, B. Floyd, U. Pfeiffer, T. Beukema, J.
A similar build-up is possible for silicon ICs if a highresistivity silicon and hence low-loss dielectric is available in the process. 9: First MMIC in 1976 by Ray Pengelly and James Turner . Reproduced by permission of © 1976 IEEE. 10: Illustration of on-chip microstrip interconnects in MMIC and Silicon IC process technologies. Silicon IC interconnects are confined in a vertical space that is an order of magnitude thinner than in MMIC technologies. Silicon IC surfaces are passivated and interconnect passives are less sensitive to encapsulation materials in contact with the IC surface.
Higher frequencies often demand low-loss materials with well-characterized dielectric properties. High-precision machining is often needed, paired with high-resolution photo-lithography process technologies and accurate alignment techniques. With the market demand for high data-rate communication, cell phones and other consumer-oriented wireless portable products, the drive towards an mmWave system in a package integration, with application-specific integrated circuits (ASICs), memory devices and mmWave devices in the same package, adds to the breadth and complexity in mmWave packaging technologies.