By Masayuki Yokoi (auth.), Kazuo Kondo, Rohan N. Akolkar, Dale P. Barkey, Masayuki Yokoi (eds.)

This e-book discusses the medical mechanism of copper electrodeposition and it really is wide variety of purposes. The ebook will disguise every little thing from the fundamental basics to sensible purposes. furthermore, the ebook also will disguise very important issues such as:

• ULSI wiring fabric established upon copper nanowiring
• revealed circuit forums
• Stacked semiconductors
• via Silicon through
• soft copper foil for Lithium-Ion battery electrodes

This booklet is perfect for nanotechnologists, pros, and practitioners.

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Additional info for Copper Electrodeposition for Nanofabrication of Electronics Devices

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Noma H, Koga T, Hirakawa C, Nonaka K, Kaibuki T, Moriyama S (2012) Analysis of Cu(I) in copper sulfate electroplating solution. J Surf Finish Soc Jpn (in Japanese) 63:124–128 42. Vogt MR, Lachenwitzer A, Magnussen OM, Behm RJ (1998) In-situ STM study of the initial stages of corrosion of Cu (100) electrodes in sulfuric and hydrochloric acid solution. Surf Sci 399:49–69 Chapter 3 Acceleration Effect Dale P. 1 Introduction Fabrication of microscale and nanoscale structures can be implemented by electrodeposition of copper onto conductive templates that contain recesses in form of the desired structure.

SPS dissociation and MPS accumulation on Cu 2. SPS physisorption on Cu so3 so3 so3 so3 so3 so3 s s X s so3 so3 so3 so3 so3 X X s X X X X s s s s s X X X X X X X X X X X s X s Cu-Growth Fig. 4 Schematic of superfilling mechanism based on the surface-contraction model. Reproduced with permission from Adolf and Landau [33] (their Fig. 2) The mechanism also accounts for the lag between the beginning of deposition and the onset of bottom-up fill, since the accelerant is only concentrated at points of high curvature after some shape change has occurred.

It is important to note that such nodules deposited at high current density can exist together with a relatively smooth surface at low current density on the same substrate. Similar surface morphologies were observed for the solution with PEG and nonionic surfactants of the PEG family such as PEG-PPG (polyoxyethylene-polyoxypropylene glycol), PNPE (Polyoxyethylen-nonylphenilether), POE (polyoxyethylene-oreilether), and so on [8]. In recent years, it has been reported that copper filling of via/trench in nanometer to micrometer size can be achieved by copper plating with a single PEG or Diallylamine-Type polymer Additive [30–35].

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