By Masayuki Yokoi (auth.), Kazuo Kondo, Rohan N. Akolkar, Dale P. Barkey, Masayuki Yokoi (eds.)

This e-book discusses the medical mechanism of copper electrodeposition and it really is wide variety of purposes. The ebook will disguise every little thing from the fundamental basics to sensible purposes. furthermore, the ebook also will disguise very important issues such as:

• ULSI wiring fabric established upon copper nanowiring
• revealed circuit forums
• Stacked semiconductors
• via Silicon through
• soft copper foil for Lithium-Ion battery electrodes

This booklet is perfect for nanotechnologists, pros, and practitioners.

Show description

Read or Download Copper Electrodeposition for Nanofabrication of Electronics Devices PDF

Similar electronics books

Teach Yourself Electricity and Electronics (4th Edition)

Fast and simply examine the hows and whys at the back of simple electrical energy, electronics, and communications –- at your individual speed, on your personal home

Teach your self electrical energy and Electronics deals easy-to-follow classes in electrical energy and electronics basics and functions from a grasp instructor, with minimum math, lots of illustrations and sensible examples, and test-yourself questions that make studying move extra quick. nice for getting ready for newbie and advertisement licensing checks, this depended on consultant deals uniquely thorough assurance, starting from dc and ac ideas and circuits to semiconductors and built-in circuits.

The top direction –- and resource –- in easy electronics

starts off with the fundamentals and takes you thru complex purposes comparable to radiolocation and robotics
jam-packed with learning-enhancing good points: transparent illustrations, functional examples, and 1000's of try out questions
is helping you remedy current-voltage-resistance-impedance difficulties and make energy calculations
Teaches uncomplicated circuit thoughts and methods for optimizing procedure potency
Explains the idea in the back of complicated audio platforms and amplifiers for stay track
Referenced by means of hundreds of thousands of scholars and execs
Written through an writer whose identify is synonymous with readability and sensible sense

Updated to mirror the newest technological developments! The Fourth variation gains new details on:

instant know-how
desktops and the net
Transducers
Sensors
Robotics
Audio structures
Navigation
Radiolocation
built-in circuits

Power Electronics Handbook (3rd Edition)

Energy electronics, that's a quickly turning out to be region when it comes to study and functions, makes use of glossy electronics expertise to transform electrical strength from one shape to a different, comparable to ac-dc, dc-dc, dc-ac, and ac-ac with a variable output significance and frequency. It has many purposes in our on a daily basis existence equivalent to air-conditioners, electrical automobiles, sub-way trains, motor drives, renewable strength resources and gear provides for pcs.

Digital Communication: Solutions Manual

This complement comprises labored out ideas to the bankruptcy finish challenge units present in electronic verbal exchange, moment version, ISBN 0-7923-9391-0.

Additional info for Copper Electrodeposition for Nanofabrication of Electronics Devices

Example text

Noma H, Koga T, Hirakawa C, Nonaka K, Kaibuki T, Moriyama S (2012) Analysis of Cu(I) in copper sulfate electroplating solution. J Surf Finish Soc Jpn (in Japanese) 63:124–128 42. Vogt MR, Lachenwitzer A, Magnussen OM, Behm RJ (1998) In-situ STM study of the initial stages of corrosion of Cu (100) electrodes in sulfuric and hydrochloric acid solution. Surf Sci 399:49–69 Chapter 3 Acceleration Effect Dale P. 1 Introduction Fabrication of microscale and nanoscale structures can be implemented by electrodeposition of copper onto conductive templates that contain recesses in form of the desired structure.

SPS dissociation and MPS accumulation on Cu 2. SPS physisorption on Cu so3 so3 so3 so3 so3 so3 s s X s so3 so3 so3 so3 so3 X X s X X X X s s s s s X X X X X X X X X X X s X s Cu-Growth Fig. 4 Schematic of superfilling mechanism based on the surface-contraction model. Reproduced with permission from Adolf and Landau [33] (their Fig. 2) The mechanism also accounts for the lag between the beginning of deposition and the onset of bottom-up fill, since the accelerant is only concentrated at points of high curvature after some shape change has occurred.

It is important to note that such nodules deposited at high current density can exist together with a relatively smooth surface at low current density on the same substrate. Similar surface morphologies were observed for the solution with PEG and nonionic surfactants of the PEG family such as PEG-PPG (polyoxyethylene-polyoxypropylene glycol), PNPE (Polyoxyethylen-nonylphenilether), POE (polyoxyethylene-oreilether), and so on [8]. In recent years, it has been reported that copper filling of via/trench in nanometer to micrometer size can be achieved by copper plating with a single PEG or Diallylamine-Type polymer Additive [30–35].

Download PDF sample

Rated 4.73 of 5 – based on 31 votes